The 2025 IEEE XXXII International Conference on Electronics, Electrical Engineering and Computing – INTERCON aims to bring together researchers, professionals, students, and entrepreneurs to foster collaboration, address global challenges, and promote the development of technologies that benefit humanity.

INTERCON is a prestigious IEEE technical conference organized by the IEEE Peru Section, recognized for its commitment to innovation and excellence in engineering and computing.

The 2025 edition will be held in person in the city of Arequipa, Peru, and will be co-organized by the Universidad Católica Santa María (UCSM) and its IEEE UCSM Student Branch. This year’s theme draws inspiration from the IEEE Future Directions platforms, with a focus on transformative and emerging technologies.

We warmly invite you to submit your technical papers for oral, on-site presentations. INTERCON 2025 will continue its tradition of providing a vibrant and dynamic platform for knowledge exchange, research dissemination, and collaboration between academia, industry, and innovators—further advancing IEEE’s mission to foster technology for the benefit of humanity.

Important Dates

• Full Paper Submission Deadline (Last Call): June 15
• Notification of Acceptance: July 1
• Camera-Ready Submission: July 20
• Author Registration Deadline: July 20
• Oral Presentations: August 20–22

Submission Guidelines

• The offcial language of INTERCON 2025 is ENGLISH. The maximum number of authors per paper, including co-authors, is six (6). Papers must be submitted in PDF format and be between six (6) and eight (8) pages long, following the https://www.ieee.org/conferences/publishing/templates
• We will use EasyChair system for submissions here: EASY CHAIR 
• Accepted papers must be presented on-site to be eligible for submission to the IEEE Xplore Digital Library.

List of Topics

• T1. Artificial Intelligence and Machine Learning
• T2. Communications and Networking
• T3. Power, Energy, and Power Electronics
• T4. Biomedical Engineering & Healthcare Technologies
• T5. Robotics, Control, Instrumentation, and Automation
• T6. Multimedia Signal Proccesing and Analytics
• T7. Devices, Circuits, and Materials
• T8. Data Science and Computing Technologies
• T9. Education in Engineering and Technology

Committees

Organizaing Committee of IEEE Peru Section 

• Conference Chair - Dr. Carlos Raymundo Ibañez
• Conference Treasurer - Dr. Guillermo Kemper Vásquez
• Technical Program Chair - Dr. Fanny Casado Peña
• Publication Chair - Msc. Gianpierre Zapata Ramirez 

Organizaing Committee of UCSM 

• Chair INTERCON 2025 – Mathias Marcelo Flores Montoya
• Advisor INTERCON 2025 – Ing. Paulo Antonio Tejada Benavides
• Public Relations Committee Chair – Sebastián Rodrigo Chipana Huaylla
• Program and Presentations Committee Chair – Stefano Víctor Javier Villazana Castillo
• Protocol Committee Chair – Paul Sergio Mestas Delgado
• Competition Committee Chair – Esteban Daniel Vera Contreras
• Marketing and Communications Committee Chair – Henry Edgardo Torres Quiñones
• Cultural and Sports Activities Committee Chair – Renato Josue Peralta Herrera
• Logistics Committee Chair – León Llanllaya Rafael Alejandro

Venue

The conference will be held in person at Universidad Católica Santa María (UCSM), in the city of Arequipa, Peru.

Contact