Cloudcom2025: The 16th IEEE International Conference on Cloud Computing Technology and Science Shenzhen, China, November 14-16, 2025 |
Conference website | http://www.cloudcom2025.org/ |
Submission link | https://easychair.org/conferences/?conf=cloudcom2025 |
Abstract registration deadline | September 6, 2025 |
Submission deadline | September 6, 2025 |
CloudCom is a premier international conference in cloud computing, uniting researchers, practitioners, engineers, and students from both academia and industry. It covers a broad spectrum of topics, including cloud computing, edge computing, virtualization, security and privacy, big data, systems architecture, service-oriented architecture, and high-performance computing. The conference has a long-standing tradition of emphasizing the advancement of impactful cloud computing platforms. Co-sponsored by the Institute of Electrical and Electronics Engineers (IEEE) and the Cloud Computing Association, CloudCom annually attracts top global experts to address emerging challenges, present cutting-edge innovations, and explore new technological frontiers.
The 16th edition of CloudCom, CloudCom 2025, will continue this tradition and expand its presence to East Asia. This prestigious event will be hosted in Shenzhen, known as the "Chinese Silicon Valley," from November 14 to November 16, 2025, providing a dynamic platform for collaboration and knowledge exchange in the heart of one of the world's leading technology hubs.
Submission Guidelines
Original and unpublished work must be submitted through the online submission system at:
https://easychair.org/conferences/?conf=cloudcom2025
Submissions should not exceed 8 pages, including tables, figures, and references in IEEE CS format. The template files for LATEX or WORD can be downloaded from the IEEE site https://www.ieee.org/conferences/publishing/templates.html. Submission must be made in PDF format only with savable text and embedded fonts.
The review process will be doubly blind, and so a submission should not include any information that may identify the authors of the manuscripts. Technical content of the camera-ready manuscript must be identical to the submitted version except for changes made to address TPC review comments.
For each accepted submission, at least one of the co-authors must have a full conference registration and present the work in person.
List of Tracks
- Track 1: Architecture, Storage and Virtualization
- Track 2: Cloud Services and Applications
- Track 3: Security, Privacy and Trust
- Track 4: IoT and Distributed Cloud
- Track 5: Cloud and Edge Computing and Mobile Communications
- Track 6: AI for Cloud Computing
- Track 7: Integrating Large Models and Distributed Cloud Computing in Next-Generation Networks
- Track 8: Cloud/Edge Computing for E-Health
Committees
Program Committee
- Victor C. M. Leung, University of British Columbia, Canada
- Chunming Rong, University of Stavanger, Norway
- Xiping Hu, Guangdong-Hong Kong-Macao Joint Laboratory for Emotional Intelligence and Pervasive Computing, China
- Wei Wang, Shenzhen MSU-BIT University, China
- Edith Ngai, University of Hong Kong, Hong Kong, China
- Xitong Li, HEC Paris, France
Organizing committee
- Victor C. M. Leung, University of British Columbia, Canada
- Chunming Rong, University of Stavanger, Norway
- Xiping Hu, Guangdong-Hong Kong-Macao Joint Laboratory for Emotional Intelligence and Pervasive Computing, China
Publications
Accepted papers will be published in the IEEE CloudCom 2025 Conference Proceedings and submitted to IEEE Xplore and EI Compendex for indexing.
In addition, selected high-quality papers will be recommended for fast-track publication in the following journals after acceptable extensions:
- IEEE Transactions on Cloud Computing
- The Journal of Cloud Computing by Springer
- IEEE Open Journal of the Communications Society
Venue
This prestigious event will be hosted in Shenzhen, China, known as the "Chinese Silicon Valley," from November 14 to 16, 2025, providing a dynamic platform for collaboration and knowledge exchange in the heart of one of the world's leading technology hubs.
Contact
General Inquiries: cloudcom2025@163.com
Sponsorship Matters: cloudcom2025@163.com